Search for: All records

Abstract Current Additive Manufacturing (AM) technologies are typically limited by the minimum feature sizes of the parts they can produce. This issue is addressed by the microscale selective laser sintering system (µ-SLS), which is capable of building parts with single micrometer resolutions. Despite the resolution of the system, the minimum feature sizes producible using the µ-SLS tool are limited by unwanted heat dissipation through the particle bed during the sintering process. To address this unwanted heat flow, a particle scale thermal model is needed to characterize the thermal conductivity of the nanoparticle bed during sintering and facilitate the prediction of heat affected zones (HAZ). This would allow for the optimization of process parameters and a reduction in error for the final part. This paper presents a method for the determination of the effective thermal conductivity of copper nanoparticle beds in a µ-SLS system using finite element simulations performed in ANSYS. A Phase Field Model (PFM) is used to track the geometric evolution of the particle groups within the particle bed during sintering. CAD models are extracted from the PFM output data at various timesteps, and steady state thermal simulations are performed on each particle group. The full simulation developed in this work is scalable to particle groups with variable sizes and geometric arrangements. The particle thermal model results from this work are used to calculate the thermal conductivity of the copper nanoparticles as a function of the density of the particle group. 

Abstract Fabrication of micro- and nanoscale electronic components has become increasingly demanding due to device and interconnect scaling combined with advanced packaging and assembly for electronic, aerospace, and medical applications. Recent advances in additive manufacturing have made it possible to fabricate microscale, 3D interconnect structures but heat transfer during the fabrication process is one of the most important phenomena influencing the reliable manufacturing of these interconnect structures. In this study, optical absorption and scattering by three-dimensional (3D) nanoparticle packings are investigated to gain insight into micro/nano heat transport within the nanoparticles. Because drying of colloidal solutions creates different configurations of nanoparticles, the plasmonic coupling in three different copper nanoparticle packing configurations was investigated: simple cubic (SC), face-centered cubic (FCC), and hexagonal close packing (HCP). Single-scatter albedo (ω) was analyzed as a function of nanoparticle size, packing density, and configuration to assess effect for thermo-optical properties and plasmonic coupling of the Cu nanoparticles within the nanoparticle packings. This analysis provides insight into plasmonically enhanced absorption in copper nanoparticle particles and its consequences for laser heating of nanoparticle assemblies. 

Abstract This work seeks to develop a fundamental understanding of slot-die coating as a nanoparticle bed deposition mechanism for a microscale selective laser sintering (μ-SLS) process. The specific requirements of the μ-SLS process to deposit uniform sub-5 μm metal nanoparticle films while enabling high throughput fabrication make the slot-die coating process a strong candidate for layer-by-layer deposition. The key challenges of a coating system are to enable uniform nanoparticle ink deposition in an intermittent layer-by-layer manner. Identifying the experimental parameters to achieve this using a slot-die coating process is difficult. Therefore, the main contribution of this study is to develop a framework to predict the wet film thickness and onset of coating defects by simulating the experimental conditions of the μ-SLS process. The single-layer deposition characteristics and the operational window for the slot-die coating setup have been investigated through experiments and two-dimensional computational fluid dynamics simulations. The effect of coating parameters such as inlet speed, coating speed, and coating gap on the wet film thickness has been analyzed. For inlet speeds higher than the coating speed, it was found that the meniscus was susceptible to high instabilities leading to coating defects. Additionally, the study outlines the conditions for which the stability of the menisci upstream and downstream of the slot-die coater can affect the uniformity and thickness range of the coating.